Product Testing

Edit Content

TF Series Solar Panel Reliability Test

Hot-spot endurance test

Test Requirements

a) No evidence of major visual defects permitted, as defined in IEC 61215-1, particularly looking for signs of melted solder, openings in the enclosure, delaminations and burn spots. If there is evidence of serious damage that does not qualify as a major visual defect, repeat the test on two additional cells within the same module. If there is no visual damage around either of these two cells the module type passes the hot-spot test.
b) Verify that the module shows the electrical characteristics of a functional photovoltaic device. MQT 02 is not a pass/fail requirement (Gate) for power loss.
c) Insulation resistance shall meet the same requirements as for the initial measurements.
d) Wet leakage current shall meet the same requirements as for the initial measurements.
e) Any damage resulting from determining the worst case shading shall be noted in the test report.

Test procedure:

Test Results:

The product did not show any abnormal pressure resistance in the above tests. The product passed the hot-spot endurance test.”

Thermal Cycling Test

Test Requirements

a) No interruption of current flow during the test; in the case of a module with parallel circuits, a discontinuity in current flow indicates an interruption of flow in one of the parallel circuit.
b) No evidence of major visual defects, as defined in IEC 61215-1.
c) Wet leakage current shall meet the same requirements as for the initial measurements.

Test Results:

The sample passed the thermal cycle test without any abnormalities and met the test requirements.”

Test procedure:

PID test

Test Requirements

a) Module temperature: 60 ℃±2 ℃
b) Chamber relative humidity: 85% ±3% relative humidity.
c) Dwell: 96 h at the above stated temperature and relative humidity (not including stabilization). —Voltage: module rated system voltage and polarities applied for above given dwell duration and during ramp down of temperature to ambient conditions.
Suggested common temperatures to use for the detection of PID in modules that do not display degradation at 60 ℃ or when further acceleration is sought are 65 ℃and 85 ℃.